Lenovo AI recording card

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Program overview

This program focuses onAI recording card (including smart recording hardware such as DingTalk A1/A1 Pro)For core display needs, relying on our company's technology accumulation and mass production capabilities in the field of display modules, combined with the project delivery experience of leading customers such as Lenovo and DingTalk, we provideUltra-thin, low power consumption, high reliability, customizationA one-stop display module solution. The solution covers the entire chain of product definition, technical design, manufacturing, quality control, supply chain assurance, and after-sales support. It adapts to the core pain points of AI recording cards: "thin and portable, long battery life, outdoor/multi-scenario use, and minimalist interaction." It helps customers create differentiated intelligent hardware products to meet the needs of efficient office work in multiple scenarios such as business records, education and research, legal consultation, and content creation.

Industry pain points/needs analysis

Industry pain points and demand analysis

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Industry pain points

Extremely light pressure: The AI recording card body is only 3.8-6.4mm thick (such as DingTalk A1 is 3.8mm thick and A1 Pro is 6.4mm thick) and weighs 40-45g. The display module thickness is required to be ≤1.2mm. Traditional modules are difficult to adapt to ultra-thin structural designs.
Low power consumption and long battery life are just needed: The recording card can record continuously for 45-180 hours and standby for 60-180 days. The display screen must meet the requirements of "zero power consumption when sleeping and low current when the screen is on." Ordinary LCD/OLED power consumption is too high, which seriously affects the battery life of the whole machine.
Complex environment shows poor adaptation: For use in multiple scenarios (outdoor strong light, indoor low light, low/high temperature environments), ordinary screens have problems such as unclear visibility under strong light, low-temperature image retention, and high-temperature aging.
Small size, high reliability, difficult to balance: The screen size is concentrated in 0.95-2.0 inches, which requires long-term high-frequency interaction (button operation, status display), and is prone to black screen, blurred screen, touch failure and other faults, and requires extremely high module stability.
The contradiction between customization and mass production efficiency: Customer needs are differentiated (size, resolution, interface, display content), there are many small batches of customization, and delivery times are tight. It is difficult for traditional production lines to balance customization flexibility and mass production consistency.

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core needs

form requirements: 0.95-1.3 inches small size, thickness ≤1.2mm, ultra-narrow bezel, special-shaped/regular screen optional, suitable for card-style appearance design.
Performance requirements: Low power consumption (sleep ≤1μA, bright screen ≤5mA), high contrast ratio ≥500:1, wide temperature operation (-20℃~+70℃), strong light visibility, fast response speed ≤10ms.
Functional requirements: Support minimalist information display such as power, recording status, AI transcription progress, Bluetooth connection, etc.; adapt to narrow-band interfaces such as SPI/I2C; support automatic sleep/wake-up, adaptive adjustment of screen brightness.
Quality requirements: Anti-drop, anti-vibration, anti-static; service life ≥50,000 hours; defective rate ≤0.3%, in line with consumer electronics industry reliability standards.
Delivery requirements: Rapid prototyping (15-25 days), batch delivery (15-25 days), flexible production capacity support (monthly production of 500,000 pieces), full-link traceability

Core product solutions

one

Product selection and technical route

Suitable for AI recording card needs, recommended0.95/1.22/1.3 inch COG structure OLED/LCD display module, the core technical route is as follows:

COG Structure (Core Scheme): The IC is directly bound to the ITO glass, eliminating the need for a PCB board. The module thickness is controlled at 0.8-1.2mm, which is more than 30% thinner than the traditional COB structure, and is suitable for an extremely thin and light body. It supports 0.4mm ultra-thin glass, has strong pressure resistance, and is suitable for the bending resistance of card-type products.

Display technology selection
OLED (flagship solution): Self-luminous, contrast ratio ≥10000:1, response speed ≤1μs, viewing angle 170°, strong visibility under strong light; extremely low power consumption, zero power consumption in sleep mode, only 2-3mA when turning on the screen, suitable for long battery life needs; supports monochrome/color display, suitable for display scenarios such as power, recording waveforms, status icons (such as the standard 0.95-inch color OLED screen of DingTalk A1).
LCD (cost-effective solution): Transmissive/reflective type is optional. Reflective LCD can be viewed in outdoor strong light, power consumption is ≤1mA, and the cost is 20%-30% lower than OLED. It is suitable for black and white/segment code display and is suitable for basic recording cards (only displays power and recording status).

two

Core product parameters (compatible with DingTalk A1/A1 Pro and similar products)

1. 0.95-inch color OLED module (same model as DingTalk A1)

sheet

parameter	Specification
size	0.95 inches
resolution	128×64
Display color	65K color
brightness	300cd/㎡(adjustable)
Contrast	10000:1
perspective	170° (full viewing angle)
thickness	0.9mm (COG structure)
Power consumption	Bright screen 2.5mA, sleep 0μA
interface	SPI (3-wire/4-wire)
working temperature	-20℃~+70℃
life	50,000 hours

three

Customization capabilities

Form customization: Supports 0.9-3 inches non-standard size, special-shaped cutting (circle/oval/rounded rectangle), ultra-narrow frame (frame ≤0.3mm), FPC cable customization (length/pin definition/connector model).
Function customization:
- Display content customization: battery icon, recording waveform, AI transcoding progress bar, multi-language status prompts (Chinese/English/Japanese/Korean), Bluetooth connection logo, etc.
- Power consumption optimization customization: sleep time customization (10s/30s/60s), adaptive brightness adjustment (photosensitive sensor linkage), low-voltage operation (2.8V-3.3V).
- Interface customization: SPI/I2C/MCU interface compatible, supports 1.8V/3.3V level, adapts to different main control chips (such as Hengxuan BES2800).
Appearance customization: Customized cover glass (AG anti-glare, AR anti-reflection, AF anti-fingerprint processing), black/white/silver frame, silk screen logo/icon.

Technical design plan

(1) Low power consumption design

Screen power consumption control: OLED adopts "dynamic refresh rate + partial lighting" technology, only the display area lights up, and the non-display area sleeps; LCD adopts a reflective design, no backlight is needed, and the power consumption is reduced to less than 1mA; in sleep mode, the screen is powered off and has zero power consumption output.
Circuit power optimization: Choose a low-power driver IC (such as SSD1306) with an operating current of ≤1mA; the power management chip (PMIC) accurately controls the screen power supply to avoid standby leakage; the FPC cable adopts a low-impedance design to reduce transmission losses.
Software collaborative optimization: Provides driver source code adaptation, supports command control of the main control chip (such as Hengxuan BES2800), and realizes the intelligent power management logic of "turn on the screen during recording, sleep for 30 seconds, and wake up by pressing the button".

(2) Reliability design

structural reliability: COG structure binding accuracy ±5μm, bonding strength ≥5N, anti-vibration (10-2000Hz, 0.1g²/Hz), anti-drop (1.2m six-sided drop); module edges are glued and reinforced, moisture-proof and dust-proof (IP54), suitable for complex use environments such as pockets and backpacks.
environmental adaptability: Wide-temperature liquid crystal material/OLED organic layer optimization, no image retention at low temperature (-20℃) and no aging at high temperature (+70℃); anti-static design (ESD≥±8kV) to avoid electrostatic breakdown of the driver IC; anti-UV material, no yellowing or fading when used outdoors for a long time.
life guarantee: OLED uses long-lasting organic materials, with brightness attenuation ≤30% (50,000 hours); LCD uses wear-resistant electrodes, with no screen burn-in for long-term display; full-process aging test (85°C/1,000 hours) to screen out early failure products.

(3) Display effect optimization

Optimized for strong light visibility: OLED high brightness (300cd/㎡) + high contrast (10000:1), clearly visible under strong outdoor light; LCD reflective design, using natural light reflection, no backlight required, strong outdoor visibility.
Low temperature display optimization: Built-in temperature compensation algorithm, the NTC thermistor collects the ambient temperature and dynamically adjusts the driving voltage to avoid slow response of the liquid crystal and attenuation of OLED brightness at low temperatures.
Viewing angle optimization: OLED full viewing angle (170°), no color cast up, down, left, and right; LCD wide viewing angle design (140°), adaptable to viewing needs at different angles.

Manufacturing plan

Production process (full link control)

Substrate cleaning → COG bonding → FPC lamination → optical lamination → cover assembly → functional test → aging test → appearance inspection → packaging and shipping

Precision machining: Introducing COG bonding machine (accuracy ±3μm) and fully automatic laminating machine imported from Japan to ensure ultra-thin module processing accuracy; 0.4mm ultra-thin glass dedicated production line to avoid glass breakage and warping.
Automated production: The automation rate of key processes (bonding, fitting, and testing) is ≥95%, reducing manual intervention and improving mass production consistency; the AI visual inspection system detects bonding offsets, fitting bubbles, and display defects in real time, and the defect identification accuracy is ≥99.8%.
Flexible production capacity: Dual-core layout of Shenzhen R&D + Huizhou production base, 3 dedicated LCM module production lines, supporting small batch (10,000 pieces/month) customization and large batch (500,000 pieces/month) mass production; quick line change (≤2 hours), adaptable to parallel production of multiple models and multiple orders.

Quality control system (zero defect goal)

Incoming material inspection (IQC): Glass, driver IC, FPC, backlight and other raw materials are 100% inspected, supplier qualification review + batch inspection, unqualified raw materials are prohibited from entering the warehouse.
In-process inspection (IPQC): First piece confirmation in each process + inspection (once every 2 hours), key parameters (bonding accuracy, laminating pressure, display brightness) are recorded in real time, and any abnormalities will be immediately shut down for rectification.
Finished product inspection (FQC/OQC):
- Functional test: 100% test display, touch, interface, and power consumption to ensure normal function.
- Reliability test: Each batch is sampled for drop, vibration, high and low temperature, and aging tests, and can only be shipped after passing the test.
- Appearance inspection: 100% visual inspection, no scratches, no bubbles, no color cast, no dirt.
Full link traceability: The unique serial number of each module records raw material batches, production equipment, operators, and test data. After-sales problems can quickly locate the root cause.

Delivery guaranteed

Proofing cycle: 7 days for standard models, 25 days for customized models, sample test report provided.
Mass production cycle: It takes 21 days for small batches (≤100,000 pieces) and 21 days for large batches (≤500,000 pieces). Production capacity can be flexibly expanded.
Delivery capability: With a monthly output of 500,000 pieces, it has supplied more than 1 million AI recording card display modules to Lenovo and DingTalk, with a delivery on-time rate of ≥99.5%.

Supply chain assurance solution

(1) Core material supply chain

glass substrate: Strategic cooperation with domestic leading glass manufacturers (such as BOE and Tianma), exclusive supply of 0.4-1.1mm ultra-thin glass, inventory ≥ 500,000 pieces, ensuring stable delivery.
Driver IC: In-depth cooperation with chip manufacturers such as SSD, Realtek, Hengxuan, etc., low-power driver ICs (SSD1306, SSD1315) are given priority for supply, with an inventory of ≥1 million units to avoid the risk of chip shortages.
FPC/Connector: Customized production by designated high-quality suppliers, the FPC cable can withstand bending ≥100,000 times, and the connector contact resistance ≤0.1Ω, ensuring long-term stability.

(2) Supply chain risk management and control

Dual supplier strategy: Core materials (glass, IC, FPC) are all equipped with 2 or more qualified suppliers to avoid the risk of supply interruption by a single supplier.
safety stock: Safety inventory of core materials ≥ 3 months of usage to cope with sudden order growth, raw material price increases, and supply chain fluctuations.
Localized supply: Core suppliers are concentrated in the Pearl River Delta region, with a logistics cycle of ≤2 days, reducing transportation costs and shortening delivery times.